JPH0126117Y2 - - Google Patents
Info
- Publication number
- JPH0126117Y2 JPH0126117Y2 JP1983069981U JP6998183U JPH0126117Y2 JP H0126117 Y2 JPH0126117 Y2 JP H0126117Y2 JP 1983069981 U JP1983069981 U JP 1983069981U JP 6998183 U JP6998183 U JP 6998183U JP H0126117 Y2 JPH0126117 Y2 JP H0126117Y2
- Authority
- JP
- Japan
- Prior art keywords
- stem body
- reflector
- stem
- lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 35
- 230000003287 optical effect Effects 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000008188 pellet Substances 0.000 description 11
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000013307 optical fiber Substances 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
Landscapes
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983069981U JPS59176166U (ja) | 1983-05-11 | 1983-05-11 | 光半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983069981U JPS59176166U (ja) | 1983-05-11 | 1983-05-11 | 光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59176166U JPS59176166U (ja) | 1984-11-24 |
| JPH0126117Y2 true JPH0126117Y2 (en]) | 1989-08-04 |
Family
ID=30200129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983069981U Granted JPS59176166U (ja) | 1983-05-11 | 1983-05-11 | 光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59176166U (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60137972D1 (de) * | 2001-04-12 | 2009-04-23 | Matsushita Electric Works Ltd | Lichtquellenbauelement mit led und verfahren zu seiner herstellung |
| US7425083B2 (en) * | 2005-05-02 | 2008-09-16 | Samsung Electro-Mechanics Co., Ltd. | Light emitting device package |
| JP4765563B2 (ja) * | 2005-11-07 | 2011-09-07 | セイコーエプソン株式会社 | 光モジュール |
| CN102598321B (zh) * | 2009-11-27 | 2015-01-21 | 京瓷株式会社 | 发光装置 |
-
1983
- 1983-05-11 JP JP1983069981U patent/JPS59176166U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59176166U (ja) | 1984-11-24 |
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